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Two IC special policies are issued in succession, and Shenzhen is speeding up the completion of missing links in chip manufacturing and advanced packaging and testing
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Two IC special policies are issued in succession, and Shenzhen is speeding up the completion of missing links in chip manufacturing and advanced packaging and testing

2020-12-30 21:25

Recently, Shenzhen formally issued two important documents, the "Five-year Action Plan to Further Promote the Development of the Integrated Circuit Industry (2019-2023)" and the "Measures to Accelerate the Development of the Integrated Circuit Industry". Shenzhen plans to be completed by 2023. An integrated circuit industry cluster with international competitiveness and a larger industrial scale. Among them, filling the missing links in chip manufacturing and advanced packaging and testing is listed as one of the main tasks.

The Action Plan proposes that by 2023, the overall sales revenue of Shenzhen's industry will exceed 200 billion yuan, the sales revenue of the design industry will exceed 160 billion yuan, and the sales revenue of manufacturing and related links will reach 40 billion yuan. Introduce and cultivate 10 key enterprises with sales revenue of more than 2 billion yuan.   

The main task is to introduce chip manufacturing lines. Position 28 nanometers and below advanced manufacturing technology and high-end characteristic technology such as radio frequency, power, sensor, display driver, strengthen cooperation with global integrated circuit manufacturing leading enterprises, and invest in the construction of 1-2 8--12 inch production lines. And enhance the competitiveness of the high-end chip design industry, and accelerate the cultivation of third-generation semiconductors.   

In terms of promoting breakthroughs in core and key technologies, it will focus on making breakthroughs in chip manufacturing at 14nm, 10nm and below nodes. The "Several Measures" put forward relevant incentives and subsidies for integrated circuit companies in terms of supporting and improving the industrial chain, supporting core technology research, supporting the development and application of new technologies and new products, supporting increased investment and financing capabilities, and supporting the introduction and training of industrial talents. . For the first time that the annual operating income of Shenzhen integrated circuit companies exceeded 100 million yuan, 300 million yuan, 500 million yuan, 1 billion yuan, and 2 billion yuan, the core team of the company was given 1 million yuan, 2 million yuan, 3 million yuan, and 4 million yuan respectively. , A one-time reward of 5 million yuan, once every step up.   

To the unit (or consortium) that undertakes and completes the core technology breakthrough task, grant a subsidy of up to 50% of the technology research and development cost. For those who have won the highest national science and technology award, a one-time award of 10 million yuan will be given to the winner; for those who have won the National Natural Science Award, the National Technical Invention Award, the National Science and Technology Progress Award, the first prize, the second prize or The lead implementation unit will give one-off rewards of 3 million yuan, 2 million yuan and 1 million yuan respectively. In addition, it provides EDA (Electronic Design Automation) tools and IP (intellectual property) cores, design solutions, advanced process tapeout, advanced packaging and testing services, testing and verification equipment, etc. to the public service platform for integrated circuit design, manufacturing, and packaging and testing. For enterprises in Shenzhen to carry out high-end chip research and development support services, a one-time subsidy of 20% of the actual construction investment of the platform will be given, and the maximum total subsidy will not exceed 30 million yuan. According to the platform's operating services, rewards are based on 10% of the main business income, and the maximum annual value is 10 million yuan.   

For design companies that use multi-project wafers for research and development, a maximum of 70% of the direct tape-out cost of multi-project wafers will be granted with an annual total of no more than 3 million yuan. For companies that complete the tape-out of full-mask engineering products for the first time, a subsidy of up to 50% of the tape-out cost and an annual total of not more than 5 million yuan will be given.   

For IC design companies purchasing EDA design tool software, they will be subsidized at 20% of the actual expenses incurred, and the total annual amount for each company will not exceed 3 million yuan. To carry out research and development of high-end chips for enterprises purchasing IP, grant up to 20% of the actual cost of IP purchase, and the total annual amount for a single enterprise does not exceed 5 million yuan. For enterprises engaged in the research and development of integrated circuit EDA design tools, R&D subsidies of up to 30% of the EDA research and development costs will be given each year, with a total amount not exceeding 30 million yuan.   

For Shenzhen enterprises that sell self-developed and designed chips, and the cumulative sales amount of a single chip product exceeds 5 million yuan, the maximum 10% of the sales amount of the year will be rewarded, and the total annual reward for a single chip product does not exceed 5 million yuan. To support Shenzhen enterprises in selling key core equipment and materials for integrated circuits developed and produced by themselves, a one-time reward of no more than 10 million yuan will be given according to the maximum 30% of the sales amount.   

The "Measures" also encourage integrated circuit companies to raise funds through direct financing methods such as listing, acquisition of holding listed companies, and listing on the New Third Board, with a maximum of 10 million yuan in funding in stages. Those who report to the Shenzhen Securities Regulatory Bureau for counseling and obtain a filing notice will be granted a subsidy of no more than 1 million yuan; if the IPO application materials are officially accepted by the China Securities Regulatory Commission, a subsidy of no more than 3 million yuan will be given; A subsidy of no more than 6 million yuan for domestic A-share listings; a subsidy of no more than 2 million yuan for successful listing on the NEEQ; and a maximum of 3 million yuan for IPOs and listings on overseas exchanges Yuan funding.

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